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Technical Specifications

Screen Printer

Solder Paste Inspection

Horizontal resolution (FOV size): 1) 50mm x 50mm, 40mm x 40mm, 30mm x 30mm
Height resolution: 1µm
Inspection items: Solder paste printing quality (volume, height, area and misalignment)
High accuracy 3D inspections by 3-step algorithm
Focus adjustment,Surface area measurement,Height measurement

Pick and Place

Board Handling size: Min 50X50mm, Max 460X410mm
Board Thickness: 0.5mm to 3mm
Placement accuracy (μ + 3σ), CHIP ±0.050mm, QFP ±0.035mm
Feeders bank Capacity: 144 feeders
No. of placement Head: 6 High speed placement head
Placement speed: 6-head: 0.15 sec/CHIP - (24000CPH), 23000CPH (IPC std)
Placement accuracy A (μ + 3) and B (μ + 3) - CHIP ±0.040mm, QFP ±0.025mm
Component size: 01005 to 120X90mm (package like BGA, CSP, connectors)

Reflow Oven

Board Handling size: Min 50mm, Max 320mm
No. of zone: 8 heating zone and 2 cooling zone
No. of convection blowers: 16zone – Circulated forced Air convection System
Temperature Range: Ambient to 360°C
Temperature Accuracy: Delta T – on PCB: +/- 2°C
Repeatability: - +/- 1°C
Mass Production: +/- 2°C

Automated Optical inspection

Applicable PCB: L610 x W560mm (Max) to L50 x W50mm (Min) (Single lane)
Number of pixels: 12Megapixels
Resolution: 12μm / 7μm
Target items: Components status after mounting, components status and solder status after hardening
3D Height, and sloped surface 3-dimensional inspections , Software suite supporting high quality production.