- Electronics manufacturer in Karnataka
- +919535309996
- info@crosspointtech.com
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Crosspoint Technologies is an industry leader in high complexity low volume proto-type PCB assembly.
Crosspoint Technologies has state-of-the art infrastructure for automatic PCB assembly.
Crosspoint Technologies implements rigorous quality control measures including automated optical inspection (AOI) and functional testing to guarantee reliability and adherence to industry standards. Crosspoint Technologies can handle low, medium and high-volume production runs, utilizing streamlined processes, bulk purchasing power and experienced staff to deliver consistent, high-quality PCB assemblies on time and within budget
Crosspoint Technologies equipped with 3 SMT lines with capable of 10 zone dual conveyor reflow machine, which can handle up to 550mm with 0.4mm to 5mm thick PCB. Our core area to support customer for high critical proto type, high mixed low volume assembly.
| Machines | Machine Name | Specification |
|---|---|---|
| Screen printer | Desen HITO |
Stencil frame size: 29"X29" Printing PCB size: 50mm x 50mm to 380mm x 320mm PCB thickness: 0.4mm to 5mm Accuracy: ≥2 Cpk@±18μm@,6σ Inspection: 2D inline inspection PCB weight: ≤3kg |
| Pick and place | Yamaha YSM 20R |
PCB size: 50mm x 50mm to 380mm x 490mm (Dual conveyor) PCB thickness: 0.4mm to 5mm Accuracy: Cpk ≥ 1.0 = 0.035mm; 3σ ± 0.025mm Speed: 2x HM head 95,000 CPH / 66,000 CPH IPC 9850 Minimum Component size: 01005 Chip (in) / 0402 Chip (mm) Number of line items: Tape & reel: 120 feeder carriage exchange with 8mm width and Automated tower Tray exchanger with 30 types fixed tray. |
| Reflow | Tangtek - 8 +2 zones |
PCB size: 310mm x 410mm PCB thickness: 0.4mm to 5mm Number of zones: 8 zones + 2 cooling zones Max setting Temperature: 350°C |
| AOI | Mirtec 6e-OMNI (6 camera, 18MP) |
PCB size: 50mm x 50mm to 510mm x 460mm PCB thickness: standard: 0.5mm - 3mm / Optional: 0.5mm - 5mm FOV size: 18MP CoaXPress (3,904 x 3,904 @ 120 fps) Pixel Resolution: 15μm 3D Inspection Technology: Digital Tri-Frequency Moiré Technology – 12 Projection Blue DLP PCB Surface Clearance: 30mm PCB Edge Clearance: Top-Edge: 3mm / Bottom-Edge: 4mm Minimum Component Inspection: 0402 Chip (mm) / 01005 Chip (in) / 0.3 Pitch (mm) |
| Machines | Machine Name | Specification |
|---|---|---|
| Screen printer | DEK Horizon 02i |
Stencil frame size: 29"X29" Printing PCB size: 50mm x 50mm to 420mm x 320mm PCB thickness: 0.4mm to 5mm Accuracy: ≥1.6 Cpk@±25μm@,6σ PCB weight: ≤3kg |
| Pick and place | Yamaha iPulse m20 |
PCB size: 50mm x 50mm to 460mm x 490mm PCB thickness: 0.4mm to 5mm (Fixture for thin flux PCBs) Accuracy: CHIP +/-0.040mm; IC +/-0.025mm Speed: 30,000 CPH IPC 9850 Minimum Component size: 01005 Chip (in) / 0402 Chip (mm) Max Component height: Max 30mm*3 (Pre-placed components: max 25mm) Number of line items: Tape reel: 120 feeder carriage exchange 8mm width, Tube and Tray feeders |
| Reflow | HE-1000D (Dual conveyor) |
PCB size: 250mm x 250mm (Dual conveyor), Up to 550mm (Single conveyor) PCB thickness: 0.4mm to 5mm Number of zones: 10 zones + 2 cooling zones Max setting Temperature: 350°C |
| AOI | Vi Technology VI 3K2 |
PCB size: 50mm x 50mm to 440mm x 390mm PCB thickness: 0.7mm - 4mm Inspection Technology: Vectoral Imaging Interface: Smema PCB Surface Clearance: 30mm PCB Edge Clearance: Top-Edge Clearance: 4mm / Bottom-Edge Clearance: 5mm Minimum Component Inspection: 0603 Chip (in) |
| Machines | Machine Name | Specification |
|---|---|---|
| Screen printer | SAMKOON - XJS-1.2M (Semi-Auto) |
Stencil frame size: 22"X22" / 23"X23" / 29"X29" Printing PCB size: 50mm x 50mm to 400mm x 400mm PCB thickness: 0.4mm to 5mm Accuracy: ±50μm PCB weight: ≤3.5kg |
| Pick and Place-1 | Transtol E4 |
PCB size: 50mm x 50mm to 310mm x 290mm PCB thickness: 0.4mm to 5mm Accuracy: +/-0.035mm Speed: 12,000 CPH IPC 9850 Minimum Component size: 0201 Chip (in) / 0402 Chip (mm) Number of line items: Tape & reel 40 feeder carriage exchange 8mm width and Tray feeder for loose components. |
| Pick and Place-2 | QiHe - QM81 |
PCB size: 50mm x 50mm to 330mm x 480mm PCB thickness: 0.4mm to 5mm (Fixture for thin flux PCBs) Accuracy: CHIP +/-0.065mm; IC +/-0.040mm Speed: Up to 16,000 CPH Minimum Component size: 0402 Chip (in) / 1005 Chip (mm) Max Component height: 15mm Number of line items: Tape reel: 60 feeder carriage exchange, 8mm width, Tube and Tray feeders |
| Reflow | Tangtek 5 + 2 zones |
PCB size: 310mm x 410mm PCB thickness: 0.4mm to 3.5mm Number of zones: 5 zones + 2 cooling zones Max setting Temperature: 350°C |
| AOI | IRIS - T3 (Offline AOI) |
PCB size: 50mm x 50mm to 440mm x 390mm PCB thickness: 0.7mm - 4mm Inspection Technology: 2D inspection for component presence & non-presence and placement inspection PCB Surface Clearance: 30mm PCB Edge Clearance: Top-Edge Clearance: 4mm / Bottom-Edge Clearance: 5mm Minimum Component Inspection: 0402 Chip (in) |
PTH assembly is referred for through-hole assembly. Crosspoint Technologies is aligned with skilled stuffing team, customised forming tools along with Automated Selective soldering machine for proto type assembly and Wave soldering for low and medium volume assembly
Assembled PCB cleaning is a critical process in the EMS industry to ensure the reliability and quality of electronic components and products. Cleaning ensures the assembled PCBs are free from contaminants promoting solder flow connections, which interns ensures the solderability. Hence, Crosspoint Technologies added Automatic Aqueous cleaning machine in assembly process to ensure improved product reliability.
Mechanical assembly is a critical process, where mechanical components are assembled to create final product. Mechanical assembly includes cable assembly (assembling cables and Wiring harness), Mechanical component assembly (such as enclosures, brackets and fasteners), Precision Assembly (such as connectors, sensors, switches and other critical components) and different types of Press-fit connectors & Press-fit components. By leveraging mechanical assembly capabilities, we can help customers produce high quality products efficiently and reliably
Crosspoint Technologies has dedicated bench setups for doing functional testing of the assembled boards. The setups have all the necessary instruments for testing and debug operated by a dedicated team of test engineers. Functional testing at the EMS site helps in finding any issues and fix them quickly. This saves a lot of time for the Customers and helps with faster TTM
